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March 2001

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From:
"Marsico, James" <[log in to unmask]>
Date:
Tue, 13 Mar 2001 10:53:14 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, "Marsico, James" <[log in to unmask]>
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Could anyone (I'm sure a lot of you can...) explain the pros and cons
regarding foil lamination vs. the conventional core lamination for
multilayer boards?  I'm not just looking for cost, but engineering,
performance and reliability considerations.
Thanks,
Jim Marsico
Senior Engineer
Production Engineering
AIL/Electronics Systems Group
An EDO Company
[log in to unmask] <mailto:[log in to unmask]>

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