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February 2001

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Subject:
From:
Robert Lazzara <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 7 Feb 2001 16:47:02 EST
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In a message dated 2/7/01 1:34:16 PM, [log in to unmask] writes:

<< What about the concern of tin whisker growth?  I believe that, for some

reason, it isn't an issue with the "white" tin process.  >>

Immersion White Tin (IWT) is nonporous, and lacks the grain structure
conducive to tin dedritic growth.

IWT is an immersion process, and arguably more of a coating than a plating.
Electro-deposited tin IS NOT recommended as a solderable finish for a variety
of reasons, including a propensity for "whiskers".

For detailed IWT information look to Florida CirTek (Greely, CO), or the
International Tin Research Institute.

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