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Subject:	Re: White Tin
From:	Paul Brown <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 7 Feb 2001 21:20:56 -0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (49 lines)

White Tin is an immersion tin process that can have a limited number of
reflow operations because of the very thin nature of the deposit. Does your
supplier guarantee how may reflow cycles to expect
Original investigations by GPT over 4 years ago in the UK showed that Tin
Whiskering was also a problem


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Spencer Davis
Sent: 07 February 2001 18:50
To: [log in to unmask]
Subject: [TN] White Tin

We have had similar problems with the White Tin process.  There appears to
be an oxide or contaminate that occurs after more than one reflow operation.
This inhibits the solder wetting.  We are trying to get to the root cause.
Our CM also recommended HASL for the same reasons.  However, we don't feel
that this will yield a planar surface.  We are also looking at Immersion
Silver or Nickel/Gold as alternatives.  But they may have similar or
different process issues.

Regards,
Spencer

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