Samuel,
That is a tall order!
If you are not talking about SMT leaded components where coplanarity is an
issue, I would just suggest using an aggressive flux, dipping in a solder
pot and then thoroughly washing off the residue.
Otherwise, the only choice that I know of is the Reduced Oxide Soldering
Activation (ROSA) process invented by Rockwell at their Science Lab in
Thousand Oaks , California. They have licensed the technology to ECI of
East Rutherford, New Jersey. As of yesterday, they only had full-blown
units for refurbishing bare printed circuit boards, but they are working on
smaller modules for components. Dave Hillman has given several
presentations about the technique on behalf of a multi-company/government
lab consortium (Rockwell/Collins, Allan Bradley, SEHO, Contamination Studies
Limited, Army Research Labs, ACI/EMPF and Nortel Networks). The technique
was able to enhance the solderability of small, awfully old, US military
depot components!
Note the solution consists of a very low pH water solution of sulfuric acid
and vanadium ions, so some care is needed. It is used at room temperature.
Give Mike Pavlov a call at ECI. His number is 973-773-8686.
regards,
Bev Christian
Materials Lab Manager
Research In Motion
Waterloo, Ontario
Canada
-----Original Message-----
From: Samuel.Ares [mailto:[log in to unmask]]
Sent: February 7, 2001 12:23 PM
To: [log in to unmask]
Subject: [TN] Chemical Substance for removal of oxidation
Hello everyone...
We are looking for a certain chemical substance that could help us remove
oxidation compounds from leads on difficult to solder chips. Something that
we could dip the leads in just before soldering and that would not be too
complicated or dangerous to use and store.
Any help would be greatly appreciated.
SAMUEL ARES
Process Engineering
Leitch Technology Int.
[log in to unmask] <mailto:[log in to unmask]>
(416) 445-9640 x. 3395
----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
