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Subject:	Re: "Temprobe" thermocouples for profiling
From:	Jason Gregory <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 7 Feb 2001 11:24:11 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (46 lines)

Howard,
I'll be honest. I've used Temprobes in the past and did not like them! I would put them on, run the board and upon exiting of the oven, some probes would be in the air, measuring ambient. I f I adjusted the "tension" so they wouldn't lift, then they would skid off to the side of the pads. I got fed up with them fast. I thought they were unreliable.

Just my .02 cents.

Jason Gregory
Software Specialist - NPI Group
SCI Systems/Plant 2
13000 S. Memorial Pkwy.
Huntsville, AL. 35803
(256) 882-4107 x3728
[log in to unmask]

>>> [log in to unmask] 02/07/01 09:47AM >>>
Technetters,

Does anyone have experience using the Temprobe thermocouples for profiling
in a reflow oven? We have recently purchased 4 of these and after initial
profiles were run, the profile plot showed very jagged lines compared to
previous profiles run using "soldered-in" thermocouples. In addition,
when using the same recipe and test points on the PCBA, the max rising
slope and total time above had risen well above our standards. The lines
on the graph for the four test points are relatively far apart.

We are using a Vitronics XPM 820 ten zone oven in air, and the SlimKIC
Transmitter/Data Logger. The thermocouple tips are carefully placed on
the desired soldered leads of a soldered (previously) board. Did the
solder with the soldered-in thermocouples inhibit the rate and amount of
thermal energy transfer that much? Any suggestions or knowledge regarding
the Temprobes will be greatly appreciated.

Howard Watson
AMETEK/Dixson

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