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February 2001

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Subject:
From:
Pat Kane <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 7 Feb 2001 11:39:41 EST
Content-Type:
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In a message dated 2/7/01 10:53:43 AM US Eastern Standard Time,
[log in to unmask] writes:

> Technetters,
>
>  Does anyone have experience using the Temprobe thermocouples for profiling
>  in a reflow oven?  We have recently purchased 4 of these and after initial
>  profiles were run, the profile plot showed very jagged lines compared to
>  previous profiles run using "soldered-in" thermocouples.

Howard-
In regard to the "jagged " lines, I experienced in a past life that the use
of "temporary" probes exhibit this phenomenon if they are not attached to the
PCB in such a way that the movement of the conveyor isn't reflected in the
readout - indicating the temp probe is not maintaining constant contact with
the PCB surface.

my two cents worth

Pat Kane
CSL


>  when using the same recipe and test points on the PCBA, the max rising
>  slope and total time above had risen well above our standards.  The lines
>  on the graph for the four test points are relatively far apart.
>
>  We are using a Vitronics XPM 820 ten zone oven in air, and the SlimKIC
>  Transmitter/Data Logger.  The thermocouple tips are carefully placed on
>  the desired soldered leads of a soldered (previously) board.  Did the
>  solder with the soldered-in thermocouples inhibit the rate and amount of
>  thermal energy transfer that much?  Any suggestions or knowledge regarding
>  the Temprobes will be greatly appreciated.
>
>  Howard Watson
>  AMETEK/Dixson
>  ---

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