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February 2001

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Subject:
From:
Michael Khusid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 7 Feb 2001 11:36:10 -0500
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Hello everyone,

I used white tin finish on our medium-sized board which has several high
count BGAs. The boards looked nice and the finish was very flat. However,
our assembler reported problems soldering to it, like voids in BGAs and
similar issues (no shorts or opens though). They also recommended HASL as a
preferred finish. This does not sound right to me since HASL will not be as
flat as white tin.

I am thinking that they may have used wrong solder paste and/or did not use
enough of it. If I am on a right track, what solder paste is preferred for
white tin? Are there more gotchas for the white tin process? Would other
finishes like HASL or OSP be better for the board?

Thanks,
Mike Khusid

> -----Original Message-----
> From: DJ Robison [mailto:[log in to unmask]]
> Sent: Tuesday, February 06, 2001 3:08 PM
> To: [log in to unmask]
> Subject: Re: [TN] White tin
>
>
> I've used Omikrom quite a bit. I prefer it to bright acid. It
> has better
> coverage and is an easier process. The only negative so far
> is that it may
> react to some Flux's by staining.
>
> DJ Robison
> Process Engineering Technician
> TTM Technologies, Inc.
> Redmond Division
> 17550 NE 67th Court
> Redmond, WA. 98052
> (425) 883-7575 ext. 229
> [log in to unmask]
>
>
>
> -----Original Message-----
> From:   crbuerke [SMTP:[log in to unmask]]
> Sent:   Tuesday, February 06, 2001 11:43 AM
> To:     [log in to unmask]
> Subject:        [TN] White tin
>
> Would like to hear about any experiences anyone has
> with respect to the Omikron white tin immersion
> process used on boards.
>
> Chuck Buerke
> Photonics Systems
> Toledo, Ohio
>
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