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February 2001

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 6 Feb 2001 18:45:43 -0700
Content-Type:
text/plain
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text/plain (88 lines)
Outstanding,

Appreciate the input.

Earl


----- Original Message -----
From: "Galang, Jerry" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, February 06, 2001 3:44 PM
Subject: Re: [TN] Chip device vs pad sizes


> Earl,
> Not sure what went on last year. We us a pad with full radius ends for our
> 0603 and 0402 components. The rounded ends seem to pull the solder
> perpendicular to the length of the component, very few 'tombstones' almost
> no reports of end cap cracking, not bad for a million + boards a month.
> What is our pad formula? If you design a 'standard rectangular pad' and
> round the 'width' of the pad on both ends you have it.
>
> Jerry Galang
> Xircom, Inc.
>
> -----Original Message-----
> From: Earl Moon [mailto:[log in to unmask]]
> Sent: Tuesday, February 06, 2001 2:20 PM
> To: [log in to unmask]
> Subject: [TN] Chip device vs pad sizes
>
> I'm still down sizing pads to mount/solder chip devices. We had a
> conversation about mounting 0603's on 0402 pad configurations last year.
I'm
> still going with that with some modifications. Anyone have anything else
to
> contribute concerning increased reliability as fewer end cap cracking
> problems and solder joint failures? It all goes back to the early '80's as
> LCCC's and related stuff with TCE mismatch problems.
>
> Earl Moon
>
> Proof Of Design
>
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