What's your point Kathy? Standard Assembly Processing, as you call it,
should improve as does technology.
Rick

-----Original Message-----
From: Kathy Kuhlow [mailto:[log in to unmask]]
Sent: Tuesday, February 06, 2001 3:51 PM
To: [log in to unmask]
Subject: Re: [TN] Chip device vs pad sizes


Education, education, education.  I don't think there has been much of a
voice from the component mfg'ing end concerning the limitations of the
components in regards to standard assembly processing.  Particularily as
components get smaller and smaller.  The component mfg'ers have focused on
what the part can do but not so much on how to get the part placed so it can
work, correctly.

Kathy

>>> [log in to unmask] 02/06/01 04:19PM >>>
I'm still down sizing pads to mount/solder chip devices. We had a
conversation about mounting 0603's on 0402 pad configurations last year. I'm
still going with that with some modifications. Anyone have anything else to
contribute concerning increased reliability as fewer end cap cracking
problems and solder joint failures? It all goes back to the early '80's as
LCCC's and related stuff with TCE mismatch problems.

Earl Moon

Proof Of Design

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