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February 2001

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Subject:
From:
"Galang, Jerry" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 6 Feb 2001 14:44:59 -0800
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Earl,
Not sure what went on last year. We us a pad with full radius ends for our
0603 and 0402 components. The rounded ends seem to pull the solder
perpendicular to the length of the component, very few 'tombstones' almost
no reports of end cap cracking, not bad for a million + boards a month.
What is our pad formula? If you design a 'standard rectangular pad' and
round the 'width' of the pad on both ends you have it.

Jerry Galang
Xircom, Inc.

-----Original Message-----
From: Earl Moon [mailto:[log in to unmask]]
Sent: Tuesday, February 06, 2001 2:20 PM
To: [log in to unmask]
Subject: [TN] Chip device vs pad sizes

I'm still down sizing pads to mount/solder chip devices. We had a
conversation about mounting 0603's on 0402 pad configurations last year. I'm
still going with that with some modifications. Anyone have anything else to
contribute concerning increased reliability as fewer end cap cracking
problems and solder joint failures? It all goes back to the early '80's as
LCCC's and related stuff with TCE mismatch problems.

Earl Moon

Proof Of Design

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