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February 2001

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 6 Feb 2001 16:19:40 -0600
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I'm still down sizing pads to mount/solder chip devices. We had a
conversation about mounting 0603's on 0402 pad configurations last year. I'm
still going with that with some modifications. Anyone have anything else to
contribute concerning increased reliability as fewer end cap cracking
problems and solder joint failures? It all goes back to the early '80's as
LCCC's and related stuff with TCE mismatch problems.

Earl Moon

Proof Of Design

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