Dear technet,

We are facing of delamination problem at reflow process.
After assembly process (maximum temperature was 235C in IR-reflow),
delamination was occurred between outer layer copper foil and dielectric
layer of RCF.
Construction of defective board was 1(RCF)+6(FR-4)+1(RCF).
Our supplier is testing RCF, 260C*180sec by solder floating before
shipping, and they said that did not found any problem.
Delamination always happen between outer layer copper foil and resin.
Also, dielectric thickness of defective boards was thinner than normal
boards in the pattern area where many PTHs existed, and moreover, copper
thickness of defective boards (included plating layer) was thicker than
normal boards.
We want to know relation the above-mentioned phenomenon and delaminaiton.
Moreover, we want to know general cause of delaminaiton.
Please advise us.

Best regards,
T.Ishino

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