LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

February 2001

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET February 2001

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: Immersion Silver on flex.
From:	Creswick <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Mon, 26 Feb 2001 19:47:25 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (50 lines)

Steve/Dennis,

Forgive my ignorance, but is there an underlying Ni diffusion barrier
between the copper and silver for surface mount applications as there would
be for Cu/Ni/Au flash?  If yes, do you follow the same Ni thickness
guidelines as for Cu/Ni/Au?  If no, why not?

Is anyone gold wire bonding to an immersion Ag surface for Chip On Board
applications.  I am assuming a Ni barrier layer is used.  Correct?

Steven Creswick - CTS RF Integrated Modules


At 05:35 PM 2/26/01 EST, you wrote:
>Our experience is that the immersion silver process (all acidic solutions) is
>compatible all the flex materials we have tested.
>
>Please contact us off line for details
>
>Dennis Fritz
>MacDermid, Inc
>Waterbury, CT
>
>---------------------------------------------------------------------------
------
>Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
>Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
>---------------------------------------------------------------------------
------
>
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG