Hello,

I am investigating the solderability of different
elect. finishing of RF shields. So far I notice
significant difference between tin and nickel finish.

The particular 1"x1" brass shields with nickel plating
that I am evaluating does not seem to have very good
wetting at it's root and PCB junctions after reflow.
The paste is alpha WS678.

Does anyone else have solderability problems with
nickel finish shields? What else would you recommend?

Under what design concern/criteria would one select
nickel finish?

Thank you.

Peter
Process engineer



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