TECHNET Archives

February 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Swaroop Kommera <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Feb 2001 15:13:31 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines)
Hi,
   I am Swaroop Kommera, a grad. student at Cornell. I have a question
regarding the solder ball size/solder volume that I have to use for a
specific pad size, say for eg. 4 mil. What would be recommendedthe size
of the solder ball/vol. of solder that I have to use for a pad size of 4
mil. Is there a standard or does it depend on the stand-off height that
you are interested in. Any refernce to journals/books would be helpful.
Thanks,
Swaroop

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2