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February 2001

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Subject:
From:
Ed Valentine <[log in to unmask]>
Reply To:
Ed Valentine <[log in to unmask]>
Date:
Mon, 5 Feb 2001 20:17:42 -0500
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text/plain (54 lines)
Nicolas -

Do you have solder mask between the pads?

Ed Valentine
Electronics Manufacturing Solutions
8612 Mourning Dove Road, Raleigh, NC 27615
Phone: (919) 270-5145, Fax: (919) 847-9971
Email: [log in to unmask]
Website: http://www.ems-consulting.com

----- Original Message -----
From: "Nicolas Ortiz" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, February 05, 2001 3:45 PM
Subject: [TN] QFP144 solder bridging


> Currently we are experiencing solder bridging on a 0.5mm pitch,  LQFP,
144
> leads. I already reviewed the stencil design, screen printer parameters
and
> reflow profile. Everything is OK. We have HASL boards. Our current process
> outputs 38 dpmo's. My concern is if I reduce more the apertures, I have
the
> risk to have solder open or insufficient solder, instead of bridging. Does
> anybody has some input? What dpmo's do you have?
>
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