We're using Locktite Chipbonder 368.  It is pin dispensed and cures during
reflow.

Jim Marsico
Senior Engineer
Production Engineering
AIL/Electronics Systems Group
An EDO Company
[log in to unmask] <mailto:[log in to unmask]>

        -----Original Message-----
        From:   Graham Collins [SMTP:[log in to unmask]]
        Sent:   Friday, February 23, 2001 1:47 PM
        To:     [log in to unmask]
        Subject:        [TN] SMT adhesive

        Good day TechNet!
        I'm looking for recommendations today.  I need an adhesive that I
can dot dispense on circuit boards (Dispense head on a GSM-1) and cure in
the same oven profile as a solder paste reflow profile.  I've got a couple
of parts that need a bit of extra grip on the board (for vibration
resistance).  The parts are SMT paste attached, so the glue will have to
cure at the same time as the paste reflows.
        We currently run Loctite 3609 for our glue requirements, but I'm not
comfortable running it through the higher temperatures of a reflow profile.

        Can anyone recommend a suitable adhesive for this purpose?  If you
are the supplier please contact me direct, no SPAM to the TechNet please!

        As always, Thanks!  And a good weekend to all.


        regards

        Graham Collins
        Process Engineer, Litton Systems Canada, Atlantic Facility
        (902) 873-2000 ext 6215


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