Currently we are experiencing solder bridging on a 0.5mm pitch,  LQFP,  144
leads. I already reviewed the stencil design, screen printer parameters and
reflow profile. Everything is OK. We have HASL boards. Our current process
outputs 38 dpmo's. My concern is if I reduce more the apertures, I have the
risk to have solder open or insufficient solder, instead of bridging. Does
anybody has some input? What dpmo's do you have?

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