What:     Florida IMAPS/SMTA Symposia

        Where :  Orlando FL, Four Points Sheraton
                      (3835 McCoy Road near Orlando International Airport)

        When:    March 20th

        Looking for presenters,
session topic is "Chip Scale Assembly", and will cover PWB surface finishes,
solder paste, assembly, repair, and reliability issues.

        Preview of presentations

*       Process Optimization for 1.0 mm Pitch CBGA, Marie Cole, IBM
Microelectronics
*       PWB Surface Finishes for CSP, Lee Parker , Via Systems
*       Solderless connection, Frank Liotine
*       Rework Process for Chip Scale Components, Don Naugler, SRT

        Need to reply by 3/2/01
Please contact Tony Massini (727) 530-8168 or [[log in to unmask]] if you
have questions or are interested in presenting.

        Thanks

        Tom Obarski
        Harris Corp.
        Microsystems Technology Group
        lab (321)727-6043, beeper (321) 690-4138

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------