Hi Debbie,

IPC-A-600 and IPC-A-610 covers General Acceptability of Printed Wiring
Boards & Assemblies.  Some of the defects, target and acceptable conditions
you are interested in may be covered in those documents.

Hans

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Process Engineer
Toppan Electronics, Inc.
770 Miramar Road
San Diego, CA 92126
(858) 695 - 2222 ext. 241
(858) 695 - 6823 fax
[log in to unmask]


-----Original Message-----
From: Deborah Schepis [mailto:[log in to unmask]]
Sent: Friday, February 02, 2001 10:07 AM
To: [log in to unmask]
Subject: [TN] Specs for E-Ni / I-Au


Are there standard specs for thickness / coverage / defects for E-Ni/I-Au?
I've looked in the IPC 6012, but I'm not sure if table 3-2 is applicable
for thickness, since for Au it goes up to 30 u".  And all I can find for
coverage is in section 3.5.4.6 which is extremely general.  We're concerned
about SMT pads, soldered PTHs/lands, press fit pin PTHs/lands, and wiring
vias/lands.  Am I just looking in the wrong place?

Thanks,

Debbie

Deborah Schepis
OEM Printed Circuit Applications
Dept T46G / Bldg 022-2 / Office J004
Tie line 855-5558 / External phone (607) 755-5558 / Fax 857-1558
E-mail schepisd @ us.ibm.com

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