Jim,

The ANSI/EIA 481 (-1, -2, and -3) standards for Carrier Tapes for SM
Components specifies clearance requirements between the component body and
the molded or embossed cavity.  To address your problem, it states under
Note 1 of the dimensional table that "The cavity defined by Ao, Bo, and Ko
shall be configured to provide the following:  Surround the component with
sufficient clearance such that . . . (b) the component can be removed from
the cavity in the vertical direction without mechanical restriction, after
the cover tape has been removed." It appears that your vendor has not
supplied you with a tape that satisfies ANSI/EIA 481.

Howard A. Cyker
Lucent Technologies
Email [log in to unmask]
Phone 978-960-2964


-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: Monday, February 19, 2001 8:39 AM
To: [log in to unmask]
Subject: [TN] tape and reels


Hi, Technet,  here's a quickie...
We've been receiving 20 pin ceramic leadless chip carriers from a specific
supplier packaged in tape with tight pockets.  (We leave behind more than we
are placing.)  We use a lot of these types of components and only have a
problem with this particular supplier.  How could I specify the proper
carrier tape to ensure this doesn't continue?

Jim Marsico
Senior Engineer
Production Engineering
AIL/Electronics Systems Group
An EDO Company
[log in to unmask] <mailto:[log in to unmask]>

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