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February 2001

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Subject:
From:
Tamir Ben Shoshan <[log in to unmask]>
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Date:
Tue, 20 Feb 2001 10:39:33 +0200
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Hi,
As we all know the standard shape for 50 mil pitch BGA used the via hole
(usually with dia of 12 mil finished with 25 mil pad) connected with trace
to the ball's pad (25-27 mil).
When speaking of standard aspect ratio there is no problem with that design
but when going up to 160 mil board thickness this design is almost
impossible for most of the manufacturer( A.R=13.3). My question is if there
is any problem with the following design:
                - Ball's Pad dia.- 35 mil
                - The via hole dia. located on the ball's pad:  16-20mil
That design will contribute to the manufacturability of the board regarding
the aspect ratio, the reliability of production will increase and we'll free
some space at the BGA's area that will make the option of 5 mil trace route
at that area more easy.
I would appreciate any comment and if any one experience that design type.

Best regards,

Tamir Ben-Shoshan
Charlotte's Web Networks

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