Jeff,

Has any of your testing been published?

Any chance of getting my hands on your findings?






Jeff Ferry <[log in to unmask]>@IPC.ORG> on 02/05/2001 10:36:39 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Jeff Ferry <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  Re: [TN] BGA REWORK


Trevor,

We have 4 BGA Reworks systems that go all day. We've tested just about
every
technique possible and apply solder paste vs. flux only in almost every
case.

We've also been using a new type of disposable adhesive backed flexible
stencil for applying the paste that's been a real time saver.

Jeff Ferry
CEO
Circuit Technology Center
www.circuittechctr.com
[log in to unmask]

Chairman
IPC Repairability Committee

-----Original Message-----
From: Trevor Goddard [mailto:[log in to unmask]]
Sent: Monday, February 05, 2001 9:44 AM
To: [log in to unmask]
Subject: BGA REWORK


Hi all.
I have a question about reworing BGAs. Do you have to reprint the solder
paste before placing the component or can you lay down some flux and rely
on
the solder balls of the BGA?
Thanks in advance

Trevor Goddard,
SMT Supervisor
XLTEK
(905) 829-5300 x 348
[log in to unmask] <mailto:[log in to unmask]>

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