Our R&D department is starting to design boards with vias in pad.  The plan is
to fill the vias with Dupont CB100 silver conductive Viaplug.
Currently the plan is to have  10 mil plugged vias under all of the BGA pads to
simplify the design, and then Nickel/Gold plating of the pad.
My concern is that this concept started on one design and in two weeks has
spread to 16 designs and we have no history with boards
manufactured with conductive Viaplug.  The new designs use HASL, Nickel/Gold,
and OSP as surface finishes.  The ViaPlug has a Tg of
115 C and a TCE of 35.  The PCBs are FR4 -12 layer, and FR4 -2 layer.  Has
anyone had any good or bad experiences with this
technology?  What are the concerns using this technology?  Thank you.

Best Regards,

Michael Forrester
LeCroy Corp.

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