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February 2001

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Subject:
From:
Tony Steinke <[log in to unmask]>
Reply To:
Tony Steinke <[log in to unmask]>
Date:
Fri, 16 Feb 2001 16:00:20 -0500
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Bob,
This reply is probably a few weeks old but here it goes anyway.
The flaking resist you are referring to I am assuming is resist breakdown.
I would look more at your preclean and lamination operations.
Things to look into:
1. Etch rate or concentration of preclean solution. Also check rinse nozzles
and if
you do not have filtration on your rinse I would recommend it.
2. Check exit temperature of panels being laminated. Even though your
temperature of
rollers may be in spec. if boards are being laminated at a fast linespeed
this would greatly
affect your adhesion.
3. Profile your laminating rollers with infrared thermometer. (Grainger
carries a very nice compact one for $100.00.) Also check the footprint of
your laminating rollers- you could have uneven
pressure.
Hope this helps
Take care
Tony Steinke
----- Original Message -----
From: Robert Lazzara <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, February 12, 2001 1:36 PM
Subject: [TN] DRY FILM BLUES


> Dear PWB 'Netters:
>
> We're trying to tweak our yields at Dry Film (plating resist). Our pareto
> shows cracked, flaking resist as the next item on the hit list. The
condition
> is not unique to high current density areas, traces, etc..
>
> Any thoughts are appreciated.
>
> Robert Lazzara
>
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