David,
We use a standard scotchbrite brush(SF6N-250 grit?) using a Chemcut scrubber
as our
standard process.
For ENIG we add a microetch(30-40 microinch etch rate-sodium persulfate)
after scrub before spraying LPI.
For immersion tin we use our standard scrub, followed by a diluted version
of oxide replacement
chemistry to help with adhesion which I am currently trying to improve on.
I am curious to see how many different combinations that are being done.
Tony Steinke
----- Original Message -----
From: Albin, David <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, February 16, 2001 5:28 AM
Subject: [TN] Solder mask pre-clean
> Gents & ladies of TechNet,
> I would appreciate your assistance in a quick survey of pre-clean
> options prior to application of photoimageable soldermasks. If possible
> could you send me your answers to the following questions:
>
> 1) What preclean system are you currently using (e.g., pumice, silicon
> carbide brush, microetch)?
> 2) If microetch, what chemistry type (e.g., persulphate, ferric chloride,
> sulphuric/ peroxide, etc)?
> 3) Are there any plans to change the existing methods, and if so what are
> the drivers and what would you be changing to?
>
> Any responses would be gratefully received!
>
> Thanks in advance,
> David Albin
>
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