Hi All,
     We plan to begin fabricating multilayer boards on Rogers materials this
year (probably 4320 & 4003).
We currently use "double treat" FR4 cores and no longer have a black oxide
line.  I assume the double treat or oxide is there to promote bonding.  Are
there any suitable alternatives? Or should I start making space to set up
the oxide line again?

Thanks,
Mark Hargreaves

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