Trevor,

I think it will depend on the expected useful life of the repair. If you are
looking at short life product with eutectic solder balls, and coplanarity is
not an issue, then using just flux should not be an issue. If you require
long term reliability then in most cases paste is preferable.

Thanks,
Robert Furrow
New Product Engineering
Lucent Technologies
978-960-3224    [log in to unmask]

> -----Original Message-----
> From: Trevor Goddard [SMTP:[log in to unmask]]
> Sent: Monday, February 05, 2001 9:44 AM
> To:   [log in to unmask]
> Subject:      [TN] BGA REWORK
>
> Hi all.
> I have a question about reworing BGAs. Do you have to reprint the solder
> paste before placing the component or can you lay down some flux and rely
> on
> the solder balls of the BGA?
> Thanks in advance
>
> Trevor Goddard,
> SMT Supervisor
> XLTEK
> (905) 829-5300 x 348
> [log in to unmask] <mailto:[log in to unmask]>
>
> --------------------------------------------------------------------------
> -------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
> -------

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------