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February 2001

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 16 Feb 2001 07:44:07 -0500
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text/plain
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text/plain (53 lines)
Depends, in a production environment, on assemblies with BGA, or high pin
counts, or for use when area / aspect ratios are difficult absolutly do not
reuse paste. Steve is right it will bite you.

In prototype environments, very low volume, on assemblies with large stencil
apatures, or where you anticipate a lot of inspection, board evaluation,
test, go ahead. You probably will not notice the difference.

 Guy Ramsey
American Competitiveness Institute
Senior Lab Technician / Instructor
610 362-1200 ext 107


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Nicolas Ortiz
Sent: Thursday, February 15, 2001 9:41 PM
To: [log in to unmask]
Subject: [TN] Solder paste reuse


Solder paste reuse: does anybody has this practice? Obviously, my solder
paste supplier does not recommend it.

Nicolas Ortiz
Process Engineering Group Leader
Conexant Systems

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