Hallo David

We work with pumice jet scrubbing as Pretreatment before screenprinting
the soldermaks Coates imagecure  XV 501 T i in vertikal
doublscreenprinting.
The next steps are electroless nickel-gold and sometimes chemcal tin.
We are very satsified with pumice jetscrubbing
We tested once micro Etchign with  Sodiumpersulfatee and  also brushing
but jet scrubbing with pumice was the best.
Spezially for the  chemical tin  you  should use pumice jetscrubbing
with pumice but never microetch because you will  have an lost of
adhasion because the chemistry will go under the soldermask


Best regards from Switzerland

Heinz



Heinz Mader

SLST  Technologie PCB

Ascom AG

Belpstrasse 37 ,CH 3000 Bern 14

Phone: :     0041 31 999 37 04

Fax :            0041 31 991 82 53

MailTo: [log in to unmask]

Besuchen Sie unsere Homepage

http/www.ascom.ch/elektronik







"Albin, David" <[log in to unmask]>@IPC.ORG> on 16.02.2001
11:28:33

Bitte antworten an "TechNet E-Mail Forum." <[log in to unmask]>; Bitte
      antworten an "Albin, David" <[log in to unmask]>

Gesendet von:  TechNet <[log in to unmask]>


An:   [log in to unmask]
Kopie:
Thema:    [TN] Solder mask pre-clean


Gents & ladies of TechNet,
        I would appreciate your assistance in a quick survey of
pre-clean
options prior to application of photoimageable soldermasks. If possible
could you send me your answers to the following questions:

1) What preclean system are you currently using (e.g., pumice, silicon
carbide brush, microetch)?
2) If microetch, what chemistry type (e.g., persulphate, ferric
chloride,
sulphuric/ peroxide, etc)?
3) Are there any plans to change the existing methods, and if so what
are
the drivers and what would you be changing to?

Any responses would be gratefully received!

Thanks in advance,
        David Albin

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