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February 2001

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Subject:
From:
Rick Thompson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Feb 2001 10:57:20 -0800
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We've been asked to do a small proto run of flip-chip assemblies.  I'm
looking for some insight on how best to underfill these parts.  Is manual
equipment sufficient to do this?  Any input as to materials & methods would
be appreciated.

Thanks in advance,


Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

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