We've been asked to do a small proto run of flip-chip assemblies. I'm
looking for some insight on how best to underfill these parts. Is manual
equipment sufficient to do this? Any input as to materials & methods would
be appreciated.
Thanks in advance,
Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065
+1 (805) 584-9858 x-304 voice
+1 (805) 584-1529 fax
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