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February 2001

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Subject:
From:
"Cyker, Howard A (Howie)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 5 Feb 2001 10:03:07 -0500
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Charles,

For reflow, if you use the 1210 stencil apertures for the 1206 package, you
may be printing too much solderpaste, resulting in excessive solder, and
possible solder balls beside the component.  You may also experience some
skewing as the part may "float" on the larger pad during reflow, however
this may be only a cosmetic defect depending on your quality criteria.
Reducing the stencil aperture will correct some of this, however you are
likely to require a larger aperture than you would for a 1206 package due to
the larger pad width.

Howard A. Cyker
Lucent Technologies
Email [log in to unmask]
Phone 978-960-2964


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, February 05, 2001 9:43 AM
To: [log in to unmask]
Subject: [TN] 1206 part on 1210 pads


What would be the issues, assembly/solder, in using a 1206 resistor on a
board laid out for a 1210 size?

Thanks,
Charles Lawson
General Dynamics ATS

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