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February 2001

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From:
"Campbell, William (wcampbel)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Feb 2001 11:10:16 -0500
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Scott-  Kathy's on the mark, but these two things have been most important
to me:

1.  you don't want to reflow your topside components for any great length of
time, unless your touch up and test people really need lots more to do.  I
would add time/temp topside after wave just to make sure.

2.  You want to make sure you're not activating your flux prior to wave.  No
cleans are a  more sensitive to this than other types, but check the mfg
data to get an exact temp.  You'll know if you've exceeded this by the
spiderwebbing, icicles, and shorts- similar to not having flux because you
cooked it off before the wave.

If you manage to get those two things right, and get a nice curve from room
temp to just before wave, thermal shock shouldn't be a huge issue under most
circumstances.  Then you can adjust and optimize for throughput, keeping in
mind that denser assemblies will take a little longer for a better soak.

Good luck!  Bill



-----Original Message-----
From: Rougeux, Scott [mailto:[log in to unmask]]
Sent: Thursday, February 15, 2001 10:23 AM
To: [log in to unmask]
Subject: [TN] Thermal profiles at wavesolder


Good Morning Technet.

I posed a question recently on attachment method for thermocouples at wave
solder.......Thank-You for your much diversified answers...

I have another question: In the wave solder machine at what point do you log
your measurements? Before it enters the fluxer/after it leaves the
wave/etc/etc.

What are you measuring?:

dwell time
slope
thermal shock
topside board temp

Thanks!

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