Subject: | |
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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 15 Feb 2001 11:10:16 -0500 |
Content-Type: | text/plain |
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Scott- Kathy's on the mark, but these two things have been most important
to me:
1. you don't want to reflow your topside components for any great length of
time, unless your touch up and test people really need lots more to do. I
would add time/temp topside after wave just to make sure.
2. You want to make sure you're not activating your flux prior to wave. No
cleans are a more sensitive to this than other types, but check the mfg
data to get an exact temp. You'll know if you've exceeded this by the
spiderwebbing, icicles, and shorts- similar to not having flux because you
cooked it off before the wave.
If you manage to get those two things right, and get a nice curve from room
temp to just before wave, thermal shock shouldn't be a huge issue under most
circumstances. Then you can adjust and optimize for throughput, keeping in
mind that denser assemblies will take a little longer for a better soak.
Good luck! Bill
-----Original Message-----
From: Rougeux, Scott [mailto:[log in to unmask]]
Sent: Thursday, February 15, 2001 10:23 AM
To: [log in to unmask]
Subject: [TN] Thermal profiles at wavesolder
Good Morning Technet.
I posed a question recently on attachment method for thermocouples at wave
solder.......Thank-You for your much diversified answers...
I have another question: In the wave solder machine at what point do you log
your measurements? Before it enters the fluxer/after it leaves the
wave/etc/etc.
What are you measuring?:
dwell time
slope
thermal shock
topside board temp
Thanks!
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