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February 2001

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Subject:
From:
Kathy Kuhlow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Feb 2001 09:43:50 -0600
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Scott, 

Measurments taken were: 

flux gravity
time through preheats
temp top side prior to pcb entering the solder pot
temp during solder pot
time over the solder pot.

Kat
>>> [log in to unmask] 02/15/01 09:22AM >>>
Good Morning Technet.

I posed a question recently on attachment method for thermocouples at wave
solder.......Thank-You for your much diversified answers...

I have another question: In the wave solder machine at what point do you log
your measurements? Before it enters the fluxer/after it leaves the
wave/etc/etc.

What are you measuring?:

dwell time
slope
thermal shock
topside board temp

Thanks!

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