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February 2001

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Subject:
From:
"Lam, Patrick" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Feb 2001 16:30:21 -0800
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Hi PCB Suppliers,

Can someone help me with the price difference of a PCB with different design
and via structure. Let's say board size 1.5"x2.2".

Structure A
8 layer sequential lamination. Blind via construction 1-4 and 5-8 with final
thru via from 1-8. The blind vias are terminated on surface mount component
lands. Via drill size: 0.008 with pad size 0.014. Line/space is 4/4 to 3/3.

Structure B
6 layers including RCC layer on top and bottom. laser microvia drill 0.005
on pad size 0.012. Line/space is also 4/4 to 3/3.

I would like to know the price difference on quantities of: prototype (1-2
panels), preproduction (15-30 panels) and production (50+ panel lots
ongoing).

Thanks in advance for any assistance.

Patrick Lam
Phone:(604)293.4392

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