We are considering replacing of our reduced black oxide and brown oxide
innerlayer preparation by one of "conveyerised oxide substitions) .
We made several preliminary tests and the samples were analysed by measuring
of peel strength.
The results were considerably lower compared to reduced black oxide
laminated with epoxy prepreg and brown oxide laminated with polyimide.All
"oxide substitute" suppliers reacted,that such results are expected,but
performance of "oxide substitution" should be evaluated taking into account
tests like solder float,steam test etc.
I would like to ask PCB manufacturers,how they are controlling the
properties of their "oxide substitution", especially on
polyimides,thermount,RCC,teflon etc.


Edward Szpruch
Eltek , Manager of Process Engineering
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel  ++972 3 9395050 , Fax  ++972 3 9309581
e-mail   [log in to unmask]

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