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February 2001

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Subject:
From:
Darrel Therriault <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 13 Feb 2001 09:36:50 -0800
Content-Type:
text/plain
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text/plain (49 lines)
Spencer,

We have used Entek 106A with good success from a solderability standpoint.
The problems we encountered were :

1.      ICT probes tend to get "gummed" up frequently from the OSP. We fixed
this problem by
        adding all TPs to the solder stencil so we had a solder contact
surface.

2.      Some of our boards require large grounding surfaces and the OSP does
not make for a good
        conductive coating or it gets washed away and the copper then
oxidizes and contact is
        not acceptable.

These were reason enough to change to a metal finish.

DT





-----Original Message-----
From: Spencer Davis [mailto:[log in to unmask]]
Sent: Tuesday, February 13, 2001 6:48 AM
To: [log in to unmask]
Subject: [TN] Entek OSP


What are the fabrication, assembly and test issues associated with Entek OSP
vs other finishes.  We want to use it for double sided surface mount
assemblies.

Spencer Davis
Sr. Manufacturing Engineer
Spinnaker Networks, Inc.

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