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February 2001

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Subject:
From:
"Furrow, Robert Gordon (Bob)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 13 Feb 2001 12:19:08 -0500
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Spencer,

The biggest issue we have found using an OSP coating is not so much with the
coating itself, but with the inability of the assembler to know whether
there are contaminants on the pad prior to OSP application. This results in
defects at assembly that can not be determined until parts are already
applied to the board ($$). The pads that did not wet at all can be scraped
and repaired, but it is difficult to determine if there are areas that
appear to wet but also have partially contaminated pads and thus are
reliability concerns. We generally end up junking product that exhibits this
condition. I want to stress that these busts are infrequent, but you don't
have to experience many junked assemblies to wipe out the benefits that
OSP's provide. We also have found issues when using via in pad technology
where the board vendor does not completely dry out the small vias. The OSP
coating on the surface can then be compromised and again you have assembled
product that must be junked.

As far as test is concerned, if you do not cover the test points with solder
either by wave solder or opening bottomside stencils, then you will need to
optimize your tests sets to accommodate probe contact with the harder copper
surface. If you would like to discuss further, please contact me directly.

Thanks,
Robert Furrow
New Product Engineering
Lucent Technologies
978-960-3224    [log in to unmask]

> -----Original Message-----
> From: Spencer Davis [SMTP:[log in to unmask]]
> Sent: Tuesday, February 13, 2001 9:48 AM
> To:   [log in to unmask]
> Subject:      [TN] Entek OSP
>
> What are the fabrication, assembly and test issues associated with Entek
> OSP
> vs other finishes.  We want to use it for double sided surface mount
> assemblies.
>
> Spencer Davis
> Sr. Manufacturing Engineer
> Spinnaker Networks, Inc. << File: Spencer Davis.vcf >>

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