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February 2001

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Subject:
From:
"Cyker, Howard A (Howie)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Feb 2001 10:32:14 -0500
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Dennis,

There are other BGA style connectors (like the FCI MegArray) from Advanced
Interconnect (B2B), Samtec (SamArray), and Teradyne (NexLev).  All these
connectors have eutectic "BGA" solderballs.  The reliability of the
connectors is generally based upon the CTE mis-match between the connector
body and the PWB substrate material you are soldering to.  The larger the
mis-match, the lower the reliability.  The FCI MegArray has typically used
in consumer applications, mostly PC laptops, so long term reliability (over
5 years) in harsh environments is not generally a concern.  These BGA style
connectors are as easy to assembly as BGA's, however the leads still cannot
be inspected except by x-ray or a side-view microscope (like an ERSAScope).

Howard A. Cyker
Lucent Technologies
Email [log in to unmask]
Phone 978-960-2964




-----Original Message-----
From: Dennis Manowski [mailto:[log in to unmask]]
Sent: Friday, February 09, 2001 11:23 AM
To: [log in to unmask]
Subject: Re: [TN] (TN) BGA area array connectors - how reliable?


Dear TechNetters,

For a new high speed design, I'm told that I must
design in an area array connector like the FCI-Berg
Meg Array which has 8 rows of 30 contacts per row on a
1.27mm pitch and solder ball terminations just like a
BGA.

The FCI-Berg Meg Array is the only connector I have
seen that has the solder ball terminations. Other
connector manufacturers have similar area array
connectors but no BGA solder ball contacts, they have
conventional plated SMT contact leads.

My question is; Will the FCI BGA connector provide
better reliability or processing advantages over a
similar area array connector (one where you cannot
visually inspect the solder joints) that does not have
a solder ball to solder to, rather a conventional
stamped and plated SMT contact lead?


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