TECHNET Archives

February 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Abu-Hamdeh, Gus" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Feb 2001 16:02:38 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (57 lines)
From my experience:
We had a problem with wedge bonding when we were running the IC through the
Inline cleaner (DI water).  The Al nor the Au bonds were not sticking to the
Al pad on the IC.  We were using a Sn62 with WS flux.  Then we changed to
Sn62 with Mildy Activated Rosin flux and the flux was removed using Alcohol.
When we did that the problem went away.

Gus Abu-Hamdeh
Maxtek Component Corp.
2905 Southwest Hocken Avenue
Beaverton, OR 97005
(503) 627-2393


> -----Original Message-----
> From: Douglas Pauls [SMTP:[log in to unmask]]
> Sent: Friday, February 02, 2001 2:08 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] DI water and aluminum bond pads
>
> Mike brings up some good points, but I should be more specific.  We are
> talking about the bonding of wires (e.g. wedge bonding or ball bonding) to
> the affected pads, not adhesive or organic material bonding.  Can the high
> purity DI water be changing the characteristics of the pad such that I get
> poor bonding between the wire and the pad.
>
> Doug Pauls
> Rockwell Collins
>
> P.S.  Yes, the new job is everything I hoped for.
>
> --------------------------------------------------------------------------
> -------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
> -------

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2