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February 2001

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From:
"Mikell, Steve" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Feb 2001 18:41:47 -0500
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Doug,

Never, ever quit,
Did a little more looking into ball bonding, since I never really spent much
time on that side of a solder joint.

At http://extra.ivf.se/ngl/A-WireBonding/ChapterA2.htm#A2.2.2, they talk
abut the Al-Al bonds, and matching the hardness of the wire to the pad for
best strength...  could that be the case, since the raw part should be of a
different hardness than the sealed one, raw being softer?  I also enjoyed
http://www.eccb.org/pbps/tg/wirebond.htm.  My point, at this point, is
perhaps you altered the finely tuned bonding process.  Any change in surface
conditions caused by other-than-standard processes would tend to shift the
final process from optimum, even if the specific step might be considered
superior.  How are the pads cleaned in production?  With all I have looked
at today, I do not see a DI wash step in any of the bonding process
descriptions?!

Makes ya wonder. In any case, somebody else will have to provide what you
really want, which is an understanding of what exactly takes place at the
ball to pad interface during the bonding process, and how DI impacts the one
surface to upset that fine balance!

Have a nice weekend,
Steve Mikell

-----Original Message-----
From: Douglas Pauls [mailto:[log in to unmask]]
Sent: Friday, February 02, 2001 5:08 PM
To: [log in to unmask]
Subject: Re: [TN] DI water and aluminum bond pads


Mike brings up some good points, but I should be more specific.  We are
talking about the bonding of wires (e.g. wedge bonding or ball bonding) to
the affected pads, not adhesive or organic material bonding.  Can the high
purity DI water be changing the characteristics of the pad such that I get
poor bonding between the wire and the pad.

Doug Pauls
Rockwell Collins

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