Jason,
Are there reliability issues concerning the number of
heat cycles the BGA substrate has been exposed to
(initial ball placement to reballing)?
Lisa
--- Jason Gregory <[log in to unmask]> wrote:
> Trevor,
> I hit send before explaining a little more. The
> solderquik preforms are ordered in the array, pitch,
> ball count, alloy, etc desired. You wick the pads
> clean, apply tacky flux, insert preform in the
> alignment jig, insert "prepped" BGA on top of the
> preform in the jig and reflow. I usually ran 'em
> through an oven with a pretty standard profile. You
> then water down the paper that was holding all the
> ballsin place, let sit, and pull off the paper. The
> alignment jig costs around $30 or so and the
> preforms hover around $10. In previous lives, I've
> reduced scrap materials and costs boatloads! (I even
> worked at a company that threw BGA's away after
> removal.....) It's the cheapest and most efficient
> system I've used.
> Man, do I miss those mfg. eng. days!!
>
>
>
> Jason Gregory
> Software Specialist - NPI Group
> SCI Systems/Plant 2
> 13000 S. Memorial Pkwy.
> Huntsville, AL. 35803
> (256) 882-4107 x3728
> [log in to unmask]
>
> >>> [log in to unmask] 02/07/01 02:04PM >>>
> Hi everyone
> Does anyone know about reballing BGAs, in regards
> to reliability. Is the
> possible cost savings worth the risk.
>
> Thanks in advance
>
> Trevor Goddard,
> SMT Supervisor
> XLTEK
> (905) 829-5300 x 348
> [log in to unmask] <mailto:[log in to unmask]>
>
>
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