Dear TechNetters,

For a new high speed design, I’m told that I must
design in an area array connector like the FCI-Berg
Meg Array which has 8 rows of 30 contacts per row on a
1.27mm pitch and solder ball terminations just like a
BGA.

The FCI-Berg Meg Array is the only connector I have
seen that has the solder ball terminations. Other
connector manufacturers have similar area array
connectors but no BGA solder ball contacts, they have
conventional plated SMT contact leads.

My question is; Will the FCI BGA connector provide
better reliability or processing advantages over a
similar area array connector (one where you cannot
visually inspect the solder joints) that does not have
a solder ball to solder to, rather a conventional
stamped and plated SMT contact lead?


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