Are there standard specs for thickness / coverage / defects for E-Ni/I-Au?
I've looked in the IPC 6012, but I'm not sure if table 3-2 is applicable
for thickness, since for Au it goes up to 30 u".  And all I can find for
coverage is in section 3.5.4.6 which is extremely general.  We're concerned
about SMT pads, soldered PTHs/lands, press fit pin PTHs/lands, and wiring
vias/lands.  Am I just looking in the wrong place?

Thanks,

Debbie

Deborah Schepis
OEM Printed Circuit Applications
Dept T46G / Bldg 022-2 / Office J004
Tie line 855-5558 / External phone (607) 755-5558 / Fax 857-1558
E-mail schepisd @ us.ibm.com

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