This is how we specify IWT.
IMMERSION WHITE TIN WITH A MINIMUM THICKNESS OF 0.65 MICRONS WITH A MAXIMUM
THICKNESS OF 1.5 MICRONS
Steve Collins
"Marsico, James"
<James.Marsico@D To: [log in to unmask]
P.AIL.COM> cc:
Sent by: TechNet Subject: Re: [TN] More about white tin (another question)
<[log in to unmask]
>
02/08/01 10:54
AM
Please respond
to "TechNet
E-Mail Forum.";
Please respond
to "Marsico,
James"
Is the immersion tin process the same as electroless plating? How would
one
specify the IWT process on a board drawing? Is there a Mil spec or
industry
spec which can be referenced?
Jim Marsico
Senior Engineer
Production Engineering
AIL/Electronics Systems Group
An EDO Company
[log in to unmask] <mailto:[log in to unmask]>
-----Original Message-----
From: <Rudy Sedlak> [SMTP:[log in to unmask]]
Sent: Thursday, February 08, 2001 9:08 AM
To: [log in to unmask]
Subject: Re: [TN] More about white tin (another question)
Ken:
IWT, aka, immersion Tin, can be applied to any Copper based
substrate. The
plating process depends on Copper as a basis, and actually
dissolves
some
Copper in the plating process. IWT will always be more expensive
than
electroplating, at least per pound of Tin Deposited, however the
relative
cost per square foot depends on how much Tin you are
electroplating.
Generally, IWT is a relatively expensive process, but since so
little Tin is
deposited, on such a small area on printed circuit boards, it
becomes a
detail cost.
Rudy Sedlak
RD Chemical Company
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