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February 2001

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Subject:
From:
"<Rudy Sedlak>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Feb 2001 09:07:35 EST
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Ken:

IWT, aka, immersion Tin, can be applied to any Copper based substrate.  The
plating process depends on Copper as a basis, and actually dissolves some
Copper in the plating process.  IWT will always be more expensive than
electroplating, at least per pound of Tin Deposited, however the relative
cost per square foot depends on how much Tin you are electroplating.
Generally, IWT is a relatively expensive process, but since so little Tin is
deposited, on such a small area on printed circuit boards, it becomes a
detail cost.

Rudy Sedlak
RD Chemical Company

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