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February 2001

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 7 Feb 2001 19:18:33 EST
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I have to agree with Jason (BTW, in case any of you are wondering, me and
Jason are not related...least that I know of anyway...hehehe), it's so easy
with the preforms.

Just to illustrate how easy it is, the first time I saw the product was at
the SMI show in San Jose a few years back. They would reball a BGA in front
of you in a Bagel oven in less than 10-minutes! No kidding!! If I'm lyin',
I'm dyin'...

-Steve (no relation to Jason) Gregory-...Hey, I was just a poet and didn't
know it!!

<< Trevor,
 I hit send before explaining a little more. The solderquik preforms are
ordered in the array, pitch, ball count, alloy, etc desired. You wick the
pads clean, apply tacky flux, insert preform in the alignment jig, insert
"prepped" BGA on top of the preform in the jig and reflow. I usually ran 'em
through an oven with a pretty standard profile. You then water down the paper
that was holding all the ballsin place, let sit, and pull off the paper. The
alignment jig costs around $30 or so and the preforms hover around $10. In
previous lives, I've reduced scrap materials and costs boatloads! (I even
worked at a company that threw BGA's away after removal.....) It's the
cheapest and most efficient system I've used.
 Man, do I miss those mfg. eng. days!!



 Jason Gregory
 Software Specialist - NPI Group
 SCI Systems/Plant 2
 13000 S. Memorial Pkwy.
 Huntsville, AL. 35803
 (256) 882-4107 x3728
 [log in to unmask] >>

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