Hi,

I thought that the gold flash on bare copper tracks was to reduce the nickel
layer oxidising thereby ensuring a good solderable surface,
provided it is stored under dry conditions (is it 12 months?).
Not much help to you but I am sure there are many gurus out there who know all
about nickel and are dying to spread their know how.

Best of luck

Barry
-----Original Message-----
From:   Wenger, George M (George) [SMTP:[log in to unmask]]
Sent:   26 February 2001 23:56
To:     [log in to unmask]
Subject:        Re: [TN] RF Shield

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Richard,
Have you every heard of anyone having problems soldering to nickel?

Regards,

George
George M. Wenger DMTS
Bell Laboratories Princeton, Supply Network Solutions
Engineering Research Center FMA / AQA / RCA Lab
(609) 639-2769 (Office); 3210 (Lab); 2343 (Fax)
[log in to unmask]


-----Original Message-----
From: peter lee [mailto:[log in to unmask]]
Sent: Monday, February 26, 2001 5:22 PM
To: [log in to unmask]
Subject: [TN] RF Shield


Hello,

I am investigating the solderability of different
elect. finishing of RF shields. So far I notice
significant difference between tin and nickel finish.

The particular 1"x1" brass shields with nickel plating
that I am evaluating does not seem to have very good
wetting at it's root and PCB junctions after reflow.
The paste is alpha WS678.

Does anyone else have solderability problems with
nickel finish shields? What else would you recommend?

Under what design concern/criteria would one select
nickel finish?

Thank you.

Peter
Process engineer



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