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February 2001

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Feb 2001 15:55:50 -0500
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IPC-7095 will help you.

 Guy Ramsey
American Competitiveness Institute
Senior Lab Technician / Instructor
610 362-1200 ext 107


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Swaroop Kommera
Sent: Monday, February 26, 2001 3:14 PM
To: [log in to unmask]
Subject: Re: [TN] Solder size for a specific pad size


Hi,
   I am Swaroop Kommera, a grad. student at Cornell. I have a question
regarding the solder ball size/solder volume that I have to use for a
specific pad size, say for eg. 4 mil. What would be recommendedthe size
of the solder ball/vol. of solder that I have to use for a pad size of 4
mil. Is there a standard or does it depend on the stand-off height that
you are interested in. Any refernce to journals/books would be helpful.
Thanks,
Swaroop

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