Dear Mr. Hargreaves,

There are many companies offering alternatives to "black oxide".  Most of
these alternatives work on the mechanism of creating an enhanced surface
topography by way of micro-etching the copper surface, and co-depositing a
thin organic coating to provide additional chemical bonding.  The
alternatives can be processed by either vertical dip tanks or conveyorized
horizontal equipment.  Bond strength, as measured by peel strength tests,
are typically the same or better than traditional oxide.  Process times are
reduced due to fewer steps required.  Please note that these types of
alternatives do generate a copper bearing waste stream.  Different
formulations will require different etch depths and different loading
capabilities of copper in solution.  Depending on the volume of cores
processed, and the formulation capabilities of the alternative, this might
become an issue with your waste treatment system.

Murray Anderson
Insulectro

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Mark Hargreaves
Sent: Friday, February 16, 2001 12:30 PM
To: [log in to unmask]
Subject: [TN] Black oxide alternatives- multilayer bonding

Hi All,
     We plan to begin fabricating multilayer boards on Rogers materials this
year (probably 4320 & 4003).
We currently use "double treat" FR4 cores and no longer have a black oxide
line.  I assume the double treat or oxide is there to promote bonding.  Are
there any suitable alternatives? Or should I start making space to set up
the oxide line again?

Thanks,
Mark Hargreaves

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